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Rumah > Produk > Bantalan Termal > TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor

TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor

Rincian produk

Tempat asal: Vietnam

Nama merek: Ziitek

Sertifikasi: UL and RoHs

Nomor model: TIF100-30-02AS

Syarat Pembayaran & Pengiriman

Kuantitas min Order: 1000 pcs

Harga: 0.1-10 USD/PCS

Kemasan rincian: 24*13*karton 12cm

Waktu pengiriman: 3-5 hari kerja

Syarat-syarat pembayaran: T/t

Menyediakan kemampuan: 100000pcs/hari

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Menyoroti:
Nama Produk:
TIF100-30-02US Pengisi Celah Pendingin Bantalan Silikon Termal Isolasi Konduktif Tinggi Untuk Semiko
Tegangan kerusakan dielektrik:
> 5500VAC
Kepadatan:
2,9g/cm³
Aplikasi:
Semikonduktor, Peralatan Medis, Mask Aligner
Kata kunci:
Bantalan silikon termal
Warna:
Abu-abu
Konduktivitas termal:
3.0w/mk
Kekerasan:
20 pantai 00
Mencicipi:
Sampel gratis
Nama Produk:
TIF100-30-02US Pengisi Celah Pendingin Bantalan Silikon Termal Isolasi Konduktif Tinggi Untuk Semiko
Tegangan kerusakan dielektrik:
> 5500VAC
Kepadatan:
2,9g/cm³
Aplikasi:
Semikonduktor, Peralatan Medis, Mask Aligner
Kata kunci:
Bantalan silikon termal
Warna:
Abu-abu
Konduktivitas termal:
3.0w/mk
Kekerasan:
20 pantai 00
Mencicipi:
Sampel gratis
TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor

TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor

 

Ziitek TIF®100-30-02US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0.

 

Features:


> Good thermal conductive: 3.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Easy release construction
> Electrically isolating
> High durability


Applications:


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply

 

Typical Properties of TIF®100-30-02US Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 2.9g/cc ASTM D297
Thickness range 0.020"(0.5mm)~0.200"(5.0mm) ******
Hardness 20 Shore 00 ASTM 2240
Continuos Use Temp -40 to 160℃ *****
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 3.8 MHz ASTM D150
Volume Resistivity(Ohm-cm) 1.0X10¹² ASTM D257
Flame rating 94 V0 UL E331100
Thermal conductivity 3.0W/m-K ASTM D5470


Products Thickness:
0.020 inch to 0.200 inch(0.5mm to 5.0mm)

 

Products Size:

8"*16"(203mm*406mm)
TIF series Individual die cut shapes can be supplied.


Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF series sheets type can add with fiberglass reinforced.
TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor 0
Company Profile

 

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor 1

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