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Rumah > Produk > Bantalan Termal > TIF100-11US Particularly Soft 1.5W/MK Thermal Gap Filler Pad For Computer CPU/GPU Cooling

TIF100-11US Particularly Soft 1.5W/MK Thermal Gap Filler Pad For Computer CPU/GPU Cooling

Rincian produk

Tempat asal: Vietnam

Nama merek: Ziitek

Sertifikasi: RoHS

Nomor model: TIF100-11AS

Syarat Pembayaran & Pengiriman

Kuantitas min Order: 1000 buah

Harga: 0.1-10 USD/PCS

Kemasan rincian: 24*13*karton 12cm

Waktu pengiriman: 3-5 hari kerja

Syarat-syarat pembayaran: T/T

Menyediakan kemampuan: 100000pcs/hari

Dapatkan Harga Terbaik
Menyoroti:
Nama produk:
Bantalan Pengisi Celah Termal 1,5W/MK Sangat Lembut Untuk Pendinginan CPU/GPU Komputer
Bahan:
Elastomer silikon berisi keramik
Kisaran ketebalan:
0,010 inci (0,25mmT)~0,200 inci (5,0mm)
Kata kunci:
pad pengisi celah termal
Kekerasan:
65/20 Pantai 00
Warna:
Abu-abu gelap
Konduktivitas termal:
1.5W/mk
Kepadatan:
2,3g/cm³
Peringkat Api:
UL 94 V-0(E331100)
Aplikasi:
Pendinginan CPU/GPU Komputer
Nama produk:
Bantalan Pengisi Celah Termal 1,5W/MK Sangat Lembut Untuk Pendinginan CPU/GPU Komputer
Bahan:
Elastomer silikon berisi keramik
Kisaran ketebalan:
0,010 inci (0,25mmT)~0,200 inci (5,0mm)
Kata kunci:
pad pengisi celah termal
Kekerasan:
65/20 Pantai 00
Warna:
Abu-abu gelap
Konduktivitas termal:
1.5W/mk
Kepadatan:
2,3g/cm³
Peringkat Api:
UL 94 V-0(E331100)
Aplikasi:
Pendinginan CPU/GPU Komputer
TIF100-11US Particularly Soft 1.5W/MK Thermal Gap Filler Pad For Computer CPU/GPU Cooling

Particularly Soft 1.5W/MK Thermal Gap Filler Pad For Computer CPU/GPU Cooling

 

 Product descriptions

  

TIF®100-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

 

Features

 

> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available
> Outstanding thermal performance

 

Application

 

> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)Power tools
> Network communication products
> Computer CPU/GPU Cooling
> New energy vehicle power systems

> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers

 

Typical Properties of TIF®100-11US Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.3 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 4.5 ASTM D150
Volume Resistivity(Ohm-meter) >1.0X1012  ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 1.5 W/m-K ASTM D5470
1.5 W/m-K ISO22007

 

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mmX406 mm)

 

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

TIF100-11US Particularly Soft 1.5W/MK Thermal Gap Filler Pad For Computer CPU/GPU Cooling 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

 

Thermal gap pad

Thermal graphite sheet/film

Thermal double-sided tape

Thermal insulation pad

Thermal grease

Phase change material

Thermal gel

 

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

  

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