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TIF100 10020-11 10W/MK Thermal Conductivity Excellent Electrical Insulation Thermally Conductive Gap Filler Pads For Memory Modules
10W/MK Thermal Conductivity Excellent Electrical Insulation Thermally Conductive Gap Filler Pads For Memory Modules
Product descriptions
TIF®100 10020-11 Series is an ultra-soft thermal interface material specifically designed to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-like softness, achieving a low-stress perfect fit. It effectively addresses issues in high-precision assemblies, including large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.
Features:
- Excellent thermal conductivity: 10.0W/m·K
- High compression rate
- Extremely low thermal impedance
- Excellent electrical insulation properties
Applications:
- Between CPU and heat sink
- Between components and heat sinks
- Flat-panel displays
- Power supplies
- High-speed mass storage drives
- Telecommunication hardware
- 5G base station & infrastructure
- High-end chip
| Typical Properties of TIF®100 10020-11 Series |
| Property |
Value |
Test method |
| Color |
Dark Gray |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
****** |
| Density(g/cm³) |
3.3 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.012~0.020 |
0.030~0.200 |
ASTM D374 |
| 0.30~0.50 |
0.75~5.00 |
| Hardness (Shroe 00) |
20 |
20 |
ASTM 2240 |
| Recommended Operating Temperature |
-40 to 200℃ |
****** |
| Breakdown Voltage(V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant@ 1MHz |
6.4 |
ASTM D150 |
| Volume Resistivity |
＞1.0X1012 Ohm-meter |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity |
10.0 W/m-K |
ASTM D5470 |
| 10.0 W/m-K |
ISO22007 |
Product Specifications
Standard Thickness: 0.012" (0.30 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)
The TIF® series is available in customshapes and various forms.
For other thicknesses or more information,please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
VIETNAM ZIITEK TECHNOLOGY COMPANY LIMITED is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers
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