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TIF100-15-11S-D Low Density Thermal Pad For High Speed Networks And AI Servers
TIF100-15-11S-D Low Density Thermal Pad For High Speed Networks And AI Servers
Product descriptions
TIS®100-15-11S-D Series is an innovative low-density thermal pad that offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and outstanding ease of use, delivering effective heat transfer and basicphysical protection for a wide range of electronic components while achieving lightweight performance.
Features:
> Low density
> Good thermal conductivity
> Good softness and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
Applications:
> Home appliance industry
> Power module
> Wearable device
> Solar photovoltaic panel
> LED lighting fixtures
> High Speed Networks And AI Servers
| Typical Properties of TIF®100-15-11S-D Series |
| Property |
Value |
Test method |
| Color |
Dark Gray |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
****** |
| Density(g/cm³) |
2.0 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.010~0.020
(0.25~0.5)
|
0.030~0.200
(0.75~5.0)
|
ASTM D374 |
| Hardness |
65 Shore 00 |
45 Shore 00 |
ASTM 2240 |
| Continuos Use Temp |
-40 to 200℃ |
*** |
| Breakdown Voltage(V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant |
5.2 MHz |
ASTM D150 |
| Volume Resistivity |
＞1.0X1012 Ohm-meter |
ASTM D257 |
| Thermal Conductivity(W/m.K) |
1.5 |
ASTM D5470 |
| Fire rating |
V-0 |
UL 94 (E331100) |
Product Specifications
Standard Thickness: 0.010" (0.250 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"× 16" 406 mm×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
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